To provide an adhesive film for bonding semiconductor dies which generates a smaller amount of outgas than in the case of using silver paste in soldering process at 260°C, and exerts strong adhesive power.

The adhesive film is formed by mixing a thermoplastic resin, an epoxy resin, and an aralkylphenol-based epoxy-resin curing agent having three or more aromatic rings in a molecule in an organic solvent; forming a layer of the mixed solution on a base member; heating; drying; and removing the base member to obtain the adhesive film. A polyimide resin is suitable for the thermoplastic resin. Consequently, generation of the outgas is suppressed, resulting in preventing contamination of the die. In addition, the film exerts strong adhesive power, and is therefore suitable for an adhesive film for bonding semiconductor dies.

COPYRIGHT: (C)2007,JPO&INPIT