ADHESIVE FILM FOR SEMICONDUCTOR, AND LEAD FRAME AND SEMICONDUCTOR DEVICE USING THE SAME

Title:

ADHESIVE FILM FOR SEMICONDUCTOR, AND LEAD FRAME AND SEMICONDUCTOR DEVICE USING THE SAME

Document Type and Number:

Japanese Patent JPH10168204

Kind Code:

A

Abstract:

To provide an adhesive film used as an adhesive in semiconductor packaging, having an excellent cuttability and forming no burrs or cuttings when cut and to provide a lead frame and a semiconductor device using the same.

This invention provides an adhesive film obtained by forming an adhesive layer 3 made of a heat-resistant resin obtained by a reaction forming amide groups, ester groups, imido groups or ether groups on at least either surface of a supporting film being a heatresistant film surface-treated with a plasma and having excellent cuttability and a lead frame and a semiconductor device using the same.

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Inventors:

KIRIHARA HIROSHI
NOMURA YOSHIHIRO
HOSOKAWA YOICHI

Application Number:

JP33553096A

Publication Date:

June 23, 1998

Filing Date:

December 16, 1996

Export Citation:

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Assignee:

HITACHI CHEMICAL CO LTD

International Classes:

C08J7/00; B32B27/00; B32B27/16; C08J7/04; C09J7/02; C09J177/10; C09J179/08; (IPC1-7): C08J7/00; B32B27/00; B32B27/16; C08J7/04; C09J7/02; C09J177/10; C09J179/08

Attorney, Agent or Firm:

Kunihiko Wakabayashi

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