Title:
半導体用接着剤フィルム、これを用いたリードフレーム及び半導体装置
Document Type and Number:
Japanese Patent JP4686798
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain a film excellent in cutting properties and generating neither burrs nor scraps when cut off by forming as an adhesive layer a layer comprising a polyamideimide resin having copolymerized therewith a dimer acid and having a logarithmic viscosity of a specific value or higher on one surface or both surfaces of a support film. SOLUTION: There is provided an adhesive film comprising a support film 5-200 μm in thickness and a layer, formed as an adhesive layer on one surface or both surfaces thereof, comprising a polyamideimide resin having a logarithmic viscosity of at least 0.1 dl/g and obtained by copolymerizing therewith at least 1 wt.% of a dimer acid, and the thickness of the adhesive layer is preferably 1-75 μm. This adhesive film is cut into a prescribed size and sandwiched between a lead frame and a semiconductor element and is contact-bonded at 150-200 deg.C and 5-100 kg/cm2, and subsequently the lead frame and the semiconductor element are joined by gold wires or the like and sealed with an epoxy resin or the like to give a semiconductor device. The polyamideimide resin is prepared by copolymerizing trimellitic anhydride with a diamine or a diisocyanate, and a dimer acid in a solvent at 50-220 deg.C.
Inventors:
Tadashi Inukai
Application Number:
JP18359899A
Publication Date:
May 25, 2011
Filing Date:
June 29, 1999
Export Citation:
Assignee:
TOYO BOSEKI KABUSHIKI KAISHA
International Classes:
C09J179/08; C08G73/14; C09J7/02; H01L23/50
Domestic Patent References:
| JP10168204A | ||||
| JP11021454A | ||||
| JP5098232A | ||||
| JP8092543A | ||||
| JP6220406A |