Title:
半導体用接着剤フィルム、これを用いたリードフレーム及び半導体装置
Document Type and Number:
Japanese Patent JP4686799
Kind Code:
B2
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Inventors:
Tadashi Inukai
Application Number:
JP18359999A
Publication Date:
May 25, 2011
Filing Date:
June 29, 1999
Export Citation:
Assignee:
TOYO BOSEKI KABUSHIKI KAISHA
International Classes:
C09J179/08; H01L23/50; C08G73/14; C09J7/02
Domestic Patent References:
| JP10168204A | ||||
| JP11021455A | ||||
| JP5098232A | ||||
| JP8092543A | ||||
| JP9013001A |