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Title:
半導体用接着フィルム
Document Type and Number:
Japanese Patent JP7055474
Kind Code:
B2
Abstract:
The present invention relates to an adhesive film for a semiconductor, comprising: a first layer including a first adhesive binder and a heat-dissipating filler; and a second layer including a second adhesive binder and a magnetic filler, the second layer positioned on at least one surface of the first layer, wherein the adhesive film has a predetermined composition for the adhesive binder included in each of the first layer and the second layer.

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Inventors:
John Min Jean
Hee-joon Kim
Kwan Ju Yi
Application Number:
JP2020528415A
Publication Date:
April 18, 2022
Filing Date:
December 20, 2018
Export Citation:
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Assignee:
LG HAUSYS,LTD.
International Classes:
H01L21/52; C09J7/30; C09J11/04; C09J11/06; C09J133/04; C09J161/04; C09J163/00; H01L23/00
Domestic Patent References:
JP2009030043A
JP2013136766A
JP2009286977A
JP2012124465A
Attorney, Agent or Firm:
Shinya Mihiro
Takashi Watanabe



 
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