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Title:
ADHESIVE FILM AND TAPE FOR WAFER PROCESSING
Document Type and Number:
Japanese Patent JP2010265453
Kind Code:
A
Abstract:

To provide an adhesive film which allows the use of a general-purpose resin for the adhesive layer and reduces chippings of chips such as crackings and chippings upon dicing while securing the adhesion of wafers.

The adhesive film has an adhesive layer adhered to a semiconductor wafer. The adhesive layer includes an epoxy resin, an acrylic copolymer, and an inorganic filler as the indispensable ingredients. Letting the density of the adhesive layer be ρ (g/cm3) and the minimum storage elastic modulus obtained by heating the unhardened adhesive layer from room temperature to 200°C at a temperature rising rate of 10°C/min at a frequency of 1 HZ be Gmin (MPa), ρ×Gmin is ≥0.2. The adhesive layer has an adhesion 90°-peeling force of ≥50 mN/cm as measured at a tensile speed of 50 mm/min at room temperature, after the adhesive layer is bonded to a wafer at 60°C.

COPYRIGHT: (C)2011,JPO&INPIT


Inventors:
ISHIGURO KUNIHIKO
MORISHIMA YASUMASA
ISHIWATARI SHINICHI
KIM YOUNG-SEOK
AOYAMA MASAMI
SUZUKI TOSHIHIRO
CHO MASAIKU
Application Number:
JP2010095471A
Publication Date:
November 25, 2010
Filing Date:
April 16, 2010
Export Citation:
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Assignee:
FURUKAWA ELECTRIC CO LTD
International Classes:
C09J7/00; B32B27/38; C09J7/02; C09J11/00; C09J11/04; C09J133/00; C09J163/00; H01L21/301; H01L21/52; H01L21/683
Domestic Patent References:
JP2006186305A2006-07-13
JP2006261657A2006-09-28
JP2007103954A2007-04-19
JP2007053325A2007-03-01
JP2004221336A2004-08-05
JP2008218571A2008-09-18
JP2001152123A2001-06-05
JP2004186429A2004-07-02
JP2003105279A2003-04-09
JP2007035852A2007-02-08
JP2000248026A2000-09-12
JPH07216336A1995-08-15
JP2010171402A2010-08-05
JP2004356412A2004-12-16
JP2002371262A2002-12-26
Attorney, Agent or Firm:
Ryo Matsushita



 
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