Title:
ADHESIVE FILM
Document Type and Number:
Japanese Patent JP2014101519
Kind Code:
A
Abstract:
To provide an adhesive film which can be pasted at low temperatures and patterned with an alkali developer.
The provided adhesive film is an adhesive film comprising: a polyimide obtained by reacting tetracarboxylic dianhydride and diamines; a radiation-polymerizable compound; and a photopolymerization initiator and having the following characteristics: the diamines include 10-90 mol% of a specified aliphatic ether diamine with respect to all diamines; an adhesive pattern is formed by pasting the adhesive film onto an adhesion target and exposing and then developing, by using a 2.38% aqueous tetramethylammonium hydride solution, the adhesive film; another adhesion target can be adhered to the former adhesion target via the adhesive pattern.
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Inventors:
KAWAMORI TAKASHI
MASUKO TAKASHI
KATOGI SHIGEKI
YASUDA MASAAKI
MASUKO TAKASHI
KATOGI SHIGEKI
YASUDA MASAAKI
Application Number:
JP2014000944A
Publication Date:
June 05, 2014
Filing Date:
January 07, 2014
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C09J7/02; C09J4/00; C09J11/06; C09J179/08; H01L23/10
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Tomoya Furoshita
Hideki Okita
Yoshinori Shimizu
Tomoya Furoshita
Hideki Okita