Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
ADHESIVE FILM
Document Type and Number:
Japanese Patent JP3834592
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To provide an adhesive film which, when a flat film on which a plurality of coated wires are mounted is heat-sealed, can arrange and hold the coated wires flatly without detriment to the necessary adhesiveness and flexibility.
SOLUTION: An adhesive film is formed from a 60-400 μm thick flexible polyvinyl chloride resin film made from a mixture of 100 pts.wt. polyvinyl chloride resin and 25-65 pts.wt. (in terms of DOP) plasticizer and a 15-150 μm thick adhesive layer 2 comprising a hot melt adhesive and laid on either surface of the base material layer 1, and the adhesive film together with coated wires 3 is heat-sealed to arrange and hold the wires 3 flatly.


Inventors:
Toru Takayama
Shigemichi Suzuki
Kijio Niwayama
Akira Goto
Tadashi Ogushi
Application Number:
JP34713697A
Publication Date:
October 18, 2006
Filing Date:
December 02, 1997
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
DENKI KAGAKU KOGYO KABUSHIKI KAISHA
Calsonic Kansei Co., Ltd.
International Classes:
C09J7/02; C09J123/08; C09J131/04; C09J177/00; (IPC1-7): C09J7/02
Domestic Patent References:
JP4100234U
JP56122880A