Title:
接着フィルム
Document Type and Number:
Japanese Patent JP6852332
Kind Code:
B2
Abstract:
The present invention addresses the problem of providing an adhesive film or the like with which it is possible to form an insulating layer that does not cause warping, cracking, or the like when manufacturing a wiring board having an embedded wiring layer. An adhesive film which is used in a method for producing a wiring board, said method comprising: (1) a step for preparing a substrate with a wiring layer, said substrate with a wiring layer having a substrate and a wiring layer provided on at least one surface of the substrate; (2) a step in which an adhesive film containing a thermosettingresin composition layer is laminated on the substrate with the wiring layer so that the wiring layer is embedded in the thermosetting resin composition layer, and the adhesive film is thermally curedto form an insulating layer; (3) performing interlayer connection on the wiring layer; and (4) a step for removing the base material, in which a cured product obtained by thermally curing the thermosetting resin composition layer has an average linear thermal expansion coefficient of 16 ppm/DEG C or less and a breaking strength of 45 MPa or more, and the thermosetting resin composition layer is formed from a thermosetting resin composition. The thermosetting resin composition contains (a) an epoxy resin having an aromatic structure, (b) a polymer resin having a glass transition temperature of25 DEG C or less or being liquid at 25 DEG C, (c) a curing agent, and (d) an inorganic filler.
Inventors:
Hiroyuki Sakauchi
Shigeo Nakamura
Mako Genjin
Shigeo Nakamura
Mako Genjin
Application Number:
JP2016187388A
Publication Date:
March 31, 2021
Filing Date:
September 26, 2016
Export Citation:
Assignee:
AJINOMOTO CO.,LTD.
International Classes:
C09J7/38; C09J11/04; C09J11/06; C09J109/00; C09J123/00; C09J133/08; C09J133/10; C09J163/00; C09J169/00; C09J171/02; C09J183/04; C09J201/00; H01L21/56; H01L23/12; H05K1/03
Domestic Patent References:
| JP2015017247A | ||||
| JP2014015608A |
Attorney, Agent or Firm:
Sakai International Patent Office