Title:
接着剤フィルム
Document Type and Number:
Japanese Patent JP7107231
Kind Code:
B2
Abstract:
One aspect of the present invention is an adhesive film comprising: a first adhesive layer comprising a first adhesive component, a first conductive particle that is a dendritic conductive particle, and a second conductive particle that is a conductive particle other than the first conductive particle, the second conductive particle comprising a nonconductive core body and a conductive layer provided on the core body; and a second adhesive layer comprising a second adhesive component, wherein a volume proportion of the second adhesive component in the second adhesive layer is larger than a volume proportion of the first adhesive component in the first adhesive layer.
Inventors:
Tetsuyuki Shirakawa
Hiroyuki Izawa
Tatsuya Kumada
Hiroyuki Izawa
Tatsuya Kumada
Application Number:
JP2018568556A
Publication Date:
July 27, 2022
Filing Date:
February 14, 2018
Export Citation:
Assignee:
Showa Denko Materials Co., Ltd.
International Classes:
H01R11/01; C09J7/00; C09J7/30; C09J9/02; C09J11/04; C09J201/00
Domestic Patent References:
| JP2014110263A | ||||
| JP2006108523A | ||||
| JP7307179A |
Foreign References:
| WO2001064807A1 |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Hiroyuki Hirano
Hiroaki Aoki
Yuji Wada
Kazuyuki Yoshizumi
Yoshinori Shimizu
Hiroyuki Hirano
Hiroaki Aoki
Yuji Wada
Kazuyuki Yoshizumi