Title:
インサート成形用接着積層体
Document Type and Number:
Japanese Patent JP5829098
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an adhesive laminate for insert-molding capable of preventing adhesive laminated on a surface of a metal insert member from being swept away by an injection pressure of molten resin in insert-molding, and forming good adhesiveness between the insert member and injected resin.SOLUTION: An adhesive layer, which is formed by previously impregnating a cloth with a hot-melt adhesive film formed of modified polyolefin resin composition made by introducing a polar group to polyolefin resin, is laminated on the metal insert member to perform insert-molding.
Inventors:
Okada Katsuhide
Mororo Mitsutoshi
Mororo Mitsutoshi
Application Number:
JP2011235273A
Publication Date:
December 09, 2015
Filing Date:
October 26, 2011
Export Citation:
Assignee:
Kaneka Corporation
International Classes:
B32B5/28; B29C45/14; B32B27/00; C09J7/04; C09J123/14; C09J151/06
Domestic Patent References:
| JP2007254718A | ||||
| JP2010089382A | ||||
| JP2005162998A | ||||
| JP2004106302A | ||||
| JP62134232A | ||||
| JP2003094561A | ||||
| JP2007313841A |
Foreign References:
| WO2011073198A1 |
Attorney, Agent or Firm:
Atomi International Patent Office