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Patent Searching and Data


Title:
接着性積層体
Document Type and Number:
Japanese Patent JP4644415
Kind Code:
B2
Abstract:

To provide a non-silicone-based releasing agent composition providing a release sheet having good release property to an uncured polyimide-based adhesive layer, a release sheet for polyimide-based adhesive and an adhesive laminate.

The releasing agent composition comprises (A) an alkyd resin and (B) a melamine resin having average 0.1-2 (based on a triazine nucleus) primary and/secondary amino groups in (70:30) to (10:90) weight ratio based on solid content and the composition is used for formation of a releasing agent layer in a release sheet to which a polyimide-based adhesive is applied. The release sheet for polyimide-based adhesive is obtained by providing the releasing agent layer composed of the composition on a substrate. The adhesive laminate is obtained by providing an uncured layer composed of the polyimide-based adhesive on the releasing agent layer of the release sheet.

COPYRIGHT: (C)2005,JPO&NCIPI


Inventors:
Toshio Sugisaki
Daisuke Tomita
Yasushi Sasaki
Application Number:
JP2003072927A
Publication Date:
March 02, 2011
Filing Date:
March 18, 2003
Export Citation:
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Assignee:
LINTEC CORPORATION
International Classes:
B32B7/06; C09J7/02; B32B7/12; B32B27/00; C09J179/08
Domestic Patent References:
JP57049685A
JP11300894A
Attorney, Agent or Firm:
Tamotsu Otani