Title:
導電性材の接着方法、積層体及び接着剤組成物
Document Type and Number:
Japanese Patent JP4423198
Kind Code:
B2
Abstract:
In view of the above-discussed state of the art, it is an object of the present invention to provide a method of adhesion of conductive materials which uses a water-based ecofriendly adhesive and can give uniform adhesive layers capable of leading to constant and high levels of adhesion strength and excellent in insulating properties even in the case of molded articles and the like. A method of adhesion of conductive materials comprising the step (1) of forming an adhesive surface having an adhesive resin layer on a conductive material by an electrodeposition step with an adhesive composition and the step (2) of joining an adherend surface of an adhesion target to the adhesive surface having the adhesive resin layer obtained in the step (1), wherein the adhesive composition comprises a hydratable functional group- and unsaturated bond-containing cationic resin composition.
Inventors:
Hiroyuki Sakamoto
Black saki
Toshitaka Kawanami
Kazuo Morinaka
Takao Saito
Black saki
Toshitaka Kawanami
Kazuo Morinaka
Takao Saito
Application Number:
JP2004537556A
Publication Date:
March 03, 2010
Filing Date:
September 12, 2003
Export Citation:
Assignee:
NIPPON PAINT CO.,LTD.
International Classes:
B32B7/02; C09J163/04; B32B15/08; B32B27/00; C09D5/44; C09J5/00; C09J9/02; C09J163/00; C25D13/12; H01B1/22; B05D5/10; B05D7/10; C08L63/00; H05K3/02
Domestic Patent References:
| JP3112190A | ||||
| JP9157621A | ||||
| JP49102726A | ||||
| JP3259274B2 | ||||
| JP4185912B2 | ||||
| JP6295617A |
Attorney, Agent or Firm:
Kenzo Hara International Patent Office