Title:
ADHESIVE FOR PRODUCING ODORLESS WOODY BOARD
Document Type and Number:
Japanese Patent JP2002146318
Kind Code:
A
Abstract:
To reduce the amount of diffused formaldehyde released from a woody board used as building materials, etc., and to provide an odorless woody board.
This adhesive for producing the odorless woody board is obtained by using a mixture of (a) a powder of an alcohol-modified melamine resin with (b) one kind of solution selected from the group of an amino resin synthesized by reacting formaldehyde (F) with amino groups (NH2) in 0.001-0.4 molar ratio F/NH2 of the formaldehyde to the amino group and a vinylic amino resin and/or (c) an aqueous solution of a compound having the amino groups.
Inventors:
FUNAOKA SOUHEI
ONO KOJI
ITO MIKIO
ONO KOJI
ITO MIKIO
Application Number:
JP2001079330A
Publication Date:
May 22, 2002
Filing Date:
March 19, 2001
Export Citation:
Assignee:
SUMITOMO BAKELITE CO
International Classes:
B27D1/04; C09J133/26; C09J139/00; C09J161/22; C09J161/28; C09J161/34; (IPC1-7): C09J161/28; B27D1/04; C09J133/26; C09J139/00; C09J161/22; C09J161/34
Previous Patent: ADHESIVE FOR PRODUCING ODORLESS WOODY BOARD
Next Patent: THERMOSETTING ADHESIVE AND ADHESIVE FILM USING THE SAME
Next Patent: THERMOSETTING ADHESIVE AND ADHESIVE FILM USING THE SAME