Title:
接着性樹脂組成物および複合成形体
Document Type and Number:
Japanese Patent JP6931321
Kind Code:
B2
Abstract:
To provide an adhesive resin composition in which a mold deposit is suppressed and black debris is suppressed while maintaining fixed adhesiveness, and a composite molded body using the adhesive resin composition.SOLUTION: There is provided an adhesive resin composition containing a polyacetal resin, a polyethylene resin and dimer acid polyamide having melting point of 180°C or less, in which content of the dimer acid polyamide is 0.1 to 2.0 mass% of total content of the polyacetal resin and the polyethylene resin, and a mass ratio of the polyacetal resin and the polyethylene resin is 10 to 70:90 to 30.SELECTED DRAWING: None
Inventors:
Kunihiko Fujimoto
Kei Takahashi
Kei Takahashi
Application Number:
JP2017235189A
Publication Date:
September 01, 2021
Filing Date:
December 07, 2017
Export Citation:
Assignee:
Mitsubishi Engineering Plastics Co., Ltd.
Japan Polyethylene Corporation
Japan Polyethylene Corporation
International Classes:
C09J123/04; B32B27/30; C09J11/08; C09J151/00; C09J159/00
Domestic Patent References:
| JP2017080939A | ||||
| JP2010084140A | ||||
| JP2011052126A | ||||
| JP2017025257A | ||||
| JP2002138185A | ||||
| JP2003160710A | ||||
| JP2003192871A |
Foreign References:
| WO2014021413A1 |
Attorney, Agent or Firm:
Patent Service Corporation Patent Office Sykes