PURPOSE: To obtain an adhesive resin composition consisting of a specific aromatic polyamide oligomer, a maleimide compound and an epoxy compound, excellent in adhesive properties, heat resistance to soldering and dielectric strength characteristics and useful as an adhesive, etc., of copper-clad laminate for electric circuit.
CONSTITUTION: This resin composition is composed of (A) 5-60 pts.wt. of a polymerizable unsaturated group-containing aromatic polyamide oligomer randomly having recurring units of the formula (R1 and R2 are each a bifunctional aromatic group; R3 is a bifunctional group having a polymerizable unsaturated group; (m)+(n) is 2-50), (B) 5-70 pts.wt. of a maleimide compound such as N- phenylmaleimide and (C) 5-90 pts.wt. of an epoxy compound such as a bisphenol A type epoxy resin.
NAKAJIMA HIROSHI
TAKIYAMA EIICHIRO
MINOURA TAKASHI
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