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Title:
ADHESIVE RESIN COMPOSITION AND EASILY PEELABLE FILM
Document Type and Number:
Japanese Patent JP2014025047
Kind Code:
A
Abstract:

To provide an excellent adhesive resin composition, paper adhesive and easily peelable film, excellent in shot time heat sealability and heat seal strength stability, having small heat seal time dependency and no irregular fuzz of paper-made container at peeling.

An adhesive resin composition contains 29 to 84.9 wt.% of ethylene-vinyl acetate copolymer (A) containing 93 to 97 wt.% of an ethylene residue unit and 3 to 7 wt.% of a vinyl acetate residue unit and having melt mass flow rate determined by JIS K6924-1 of 8 to 30 g/10 min., 5 to 20 wt.% of an ethylene-vinyl acetate copolymer containing 80 to 90 wt.% of the ethylene residue unit and 10 to 20 wt.% of vinyl acetate residue unit, 5 to 20 wt.% of a low density polyethylene (C), 5 to 20 wt.% of a tackifier resin (D) and 0.1 to 1 wt.% of an antistatic agent (E).


Inventors:
MORISHITA ISAO
Application Number:
JP2012208464A
Publication Date:
February 06, 2014
Filing Date:
September 21, 2012
Export Citation:
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Assignee:
TOSOH CORP
International Classes:
C09J123/08; B65D65/40; B65D73/02; B65D77/20; B65D85/86; C09J7/02; C09J11/08; C09J131/04; C09K3/10; C09J123/06
Domestic Patent References:
JP2009035645A2009-02-19
JP2007519814A2007-07-19
JP2008285687A2008-11-27
JP2005325222A2005-11-24
JP2009035646A2009-02-19