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Title:
接着性樹脂組成物および易剥離性フィルム
Document Type and Number:
Japanese Patent JP7206747
Kind Code:
B2
Abstract:
To provide an adhesive resin composition excellent in low-temperature sealability, less in paper peel off of a paper container when releasing, small in degree of variation of a release strength, and small in change in adhesive strength even after storage under an environment at a high temperature and a high humidity, and an easily releasable film using the same.SOLUTION: The adhesive resin composition includes: 50 pts.wt. or more and 90 pts.wt. or less of an ethylene-vinyl acetate copolymer (A) having a vinyl acetate content measured by JIS K6924-1 of 3 wt% or more and 15 wt% or less, and a melt mass flow rate measured by JIS K6924-1 of 1 g/10 min. or higher and 40 g/10 min. or lower; 3 pts.wt. or more and 30 pts.wt. or less of at least any resin (B) of a crystalline or amorphous resin having a glass transition temperature of 60°C or higher and 120°C or lower, or a copolymer including a block segment having a glass transition temperature of 60°C or higher and 120°C or lower in a molecular structure; and 5 pts.wt. or more and 20 pts.wt. or less of a tackifier (C), where the total of (A), (B), and (C) is 100 pts.wt.SELECTED DRAWING: None

Inventors:
Daisuke Nailmoto
Morishita Isao
Shingo Koda
Application Number:
JP2018179942A
Publication Date:
January 18, 2023
Filing Date:
September 26, 2018
Export Citation:
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Assignee:
Tosoh Corporation
International Classes:
C09J131/04; B32B27/00; B32B27/28; B65D77/20; C09J7/35; C09J123/08; C09J153/00
Domestic Patent References:
JP2017110112A
JP2010209249A
JP2016113507A
JP2009256497A
Foreign References:
WO2018061442A1