Title:
ADHESIVE RESIN COMPOSITION AND ITS PREPARING PROCESS
Document Type and Number:
Japanese Patent JP2004300382
Kind Code:
A
Abstract:
To provide a non-chlorine adhesive resin composition showing favorable adhesion to a polyolefin resin and a polar resin even under a use environment which water absorption or the like would affect.
The adhesive resin composition contains a modified polyolefin resin which is obtained by graft-modifying (A) a polyolefin resin with (B) a vinyl-based monomer having no unsaturated carboxylic acid or its anhydride.
Inventors:
NAKAMURA HIROKI
TOKIMITSU TORU
KOSHIRAI ATSUNORI
TOKIMITSU TORU
KOSHIRAI ATSUNORI
Application Number:
JP2003098140A
Publication Date:
October 28, 2004
Filing Date:
April 01, 2003
Export Citation:
Assignee:
MITSUBISHI RAYON CO
International Classes:
C08F255/00; C09J123/02; C09J133/06; C09J151/06; (IPC1-7): C09J151/06; C08F255/00; C09J123/02; C09J133/06
Attorney, Agent or Firm:
Masatake Shiga
Tadashi Takahashi
Takashi Watanabe
Masakazu Aoyama
Suzuki Mitsuyoshi
Kazuya Nishi
Yasuhiko Murayama
Tadashi Takahashi
Takashi Watanabe
Masakazu Aoyama
Suzuki Mitsuyoshi
Kazuya Nishi
Yasuhiko Murayama
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