To obtain an adhesive resin composition highly adhesive enough to be directly adhesive to various substrates even in undergoing low-temperature extrusion, and to obtain a package having contents resistance by forming a laminate including a layer made from the resin composition.
This adhesive resin composition is obtained by compounding 1-50 wt.% of a least one thermoplastic resin 0.1-200 in the melt index(MI) is accordance with ASTM D1238 selected from ethylene-α,β-unsaturated carboxylic acid copolymer, ethylene-α,β-unsaturated carboxylic acid ionically crosslinked product copolymer, ethylene-α,β-unsaturated carboxylic acid ester copolymer, ethylene-vinyl acetate copolymer, acid anhydride-grafted polyolefin resin, and ethylene-α,β-unsaturated carboxylic acid ester-acid anhydride terpolymer. The laminate including the layer made from the resin composition and the package made from the laminate are also provided.
HONGO TADASHI
OHASHI YOSHISUE
KUROSAWA AKIO
