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Patent Searching and Data


Title:
ADHESIVE FOR RESIN MEMBER AND ADHESION OF RESIN MEMBER
Document Type and Number:
Japanese Patent JP2000001655
Kind Code:
A
Abstract:

To efficiently adhere resin members to each other in a short time by improving a solvent-based adhesive.

This adhesive comprises a solvent mixture containing the first solvent having a relatively high ability to dissolve a resin member to be adhered and the second solvent having higher volatility than that of the first solvent as essential components. An adhering work comprises coating the adhering surface of at least one of resin members to be adhered to each other with the adhesive and subsequently pressing the adhering surfaces to each other. When the resin member is formed from a modified copolyester obtained by modifying a polymer of terephthalic acid with ethylene glycol with cyclohexanedimethanol, the first solvent is N,N-dimethylformamide or dioxane and acetone, and the second solvent is acetone.


Inventors:
USHIDA MASAYUKI
MAKIHATA KAZUMASA
KAKUNO HIROSHI
Application Number:
JP17041498A
Publication Date:
January 07, 2000
Filing Date:
June 18, 1998
Export Citation:
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Assignee:
SHIN KOBE ELECTRIC MACHINERY
International Classes:
C08J5/12; C09J11/06; (IPC1-7): C09J11/06; C08J5/12