Title:
半導体用接着剤、半導体装置の製造方法及び半導体装置
Document Type and Number:
Japanese Patent JP7196841
Kind Code:
B2
Abstract:
An adhesive for semiconductors, which contains a thermoplastic resin having a glass transition temperature of 35°C or less.
Inventors:
Toshiyasu Akiyoshi
Takehiro Sugawara
Koichi Chabana
Shin Sato
Akiko Hayashide
Takehiro Sugawara
Koichi Chabana
Shin Sato
Akiko Hayashide
Application Number:
JP2019525654A
Publication Date:
December 27, 2022
Filing Date:
June 20, 2018
Export Citation:
Assignee:
Showa Denko Materials Co., Ltd.
International Classes:
C09J201/00; C09J7/00; C09J11/06; C09J133/00; C09J163/00; C09J171/10; C09J175/04; C09J179/08; H01L21/56; H01L23/29; H01L23/31
Domestic Patent References:
| JP2013112730A | ||||
| JP2008294382A | ||||
| JP2012184288A | ||||
| JP2017028166A | ||||
| JP2009073872A |
Foreign References:
| WO2008054012A1 | ||||
| WO2007125650A1 | ||||
| WO2008023452A1 | ||||
| WO2012043764A1 | ||||
| WO2017090439A1 | ||||
| WO2017090440A1 |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Hiroyuki Hirano
Yoshinori Shimizu
Hiroyuki Hirano