Title:
半導体用接着剤及びそれを用いた半導体装置の製造方法
Document Type and Number:
Japanese Patent JP7248007
Kind Code:
B2
Abstract:
An adhesive for a semiconductor, said adhesive being to be used for at least partly sealing connection parts of a semiconductor device wherein electrodes in respective connection parts of a semiconductor chip and a wiring circuit board are electrically connected to each other or a semiconductor device wherein electrodes in respective connection parts of a plurality of semiconductor chips are electrically connected to each other. This adhesive for a semiconductor has a thixotropy value of 1.0-3.1 inclusive, wherein the thixotropy value means a value calculated by measuring the viscosity of a sample, said sample being prepared by laminating the adhesive for a semiconductor to a depth of 400 μm, with a shear viscometer under constant conditions at a temperature of 120°C while continuously changing frequency from 1 Hz to 70 Hz, and then dividing the viscosity at 7 Hz by the viscosity at 70 Hz.
Inventors:
Tetsuya Taniguchi
Shin Sato
Koichi Chabana
Keiko Ueno
Shin Sato
Koichi Chabana
Keiko Ueno
Application Number:
JP2020502852A
Publication Date:
March 29, 2023
Filing Date:
January 17, 2019
Export Citation:
Assignee:
Resonac Co., Ltd.
International Classes:
H01L21/60; C09J7/24; C09J7/25; C09J7/35; C09J11/04; C09J11/06; C09J163/00; C09J201/00
Domestic Patent References:
| JP2001093925A | ||||
| JP2007051184A | ||||
| JP2013175546A | ||||
| JP2014175462A |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Hiroyuki Hirano
Yoshinori Shimizu
Hiroyuki Hirano
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