Title:
デバイス用接着シート
Document Type and Number:
Japanese Patent JP6980153
Kind Code:
B2
Abstract:
Provided is an adhesive sheet for devices, having a curable adhesive layer comprising component (A) and component (B), and having a component (A) content of at least 3.0 mass% in the curable adhesive layer. The adhesive sheet for devices provides a cured product having low dielectric properties in a high frequency region, and has a curable adhesive layer exhibiting an excellent adhesive suitability. Component (A): A nonaromatic curable compound that is a liquid at 25°C Component (B): A modified polyphenylene ether resin
Inventors:
Kenta Nishijima
Application Number:
JP2021521547A
Publication Date:
December 15, 2021
Filing Date:
September 29, 2020
Export Citation:
Assignee:
LINTEC CORPORATION
International Classes:
C09J7/35; C09J4/00; C09J11/06; C09J163/00; C09J171/12; C09J201/00
Domestic Patent References:
| JP5309785A | ||||
| JP2001342450A | ||||
| JP2019023263A | ||||
| JP2017014475A | ||||
| JP2015086330A | ||||
| JP2011148919A | ||||
| JP2014208845A | ||||
| JP2005197118A | ||||
| JP3210364A | ||||
| JP6122737A |
Foreign References:
| WO2016147984A1 | ||||
| WO2018179682A1 |
Attorney, Agent or Firm:
Hiroshi Kobayashi
Toshihide Ishihara
Toshihide Ishihara