Title:
ダイシング用粘着シート及びその製造方法、ダイシングダイボンディング一体型シート、並びに、半導体装置の製造方法
Document Type and Number:
Japanese Patent JP6926473
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an adhesive sheet for dicing, which is capable of reducing the stickiness of a chip when peeling off edge portion of the chip and capable of being picked up with a small peeling force in a picking up process of a semiconductor chip, and a manufacturing method thereof.SOLUTION: An adhesive sheet for dicing 1 includes: a base film 10; and an adhesive layer 20 formed over the base film 10. The adhesive layer 20 contains a compound which has at least one kind of structure unit selected from a group consisting of polyoxytetramethylene and polyoxypentamethylene.SELECTED DRAWING: Figure 1
Inventors:
Yoshifumi Sugiura
Takanobu Kobayashi
Tetsuro Yamashita
Takanobu Kobayashi
Tetsuro Yamashita
Application Number:
JP2016255212A
Publication Date:
August 25, 2021
Filing Date:
December 28, 2016
Export Citation:
Assignee:
Showa Denko Materials Co., Ltd.
International Classes:
H01L21/301; C09J7/00; C09J171/02; H01L21/52
Domestic Patent References:
| JP2016108487A | ||||
| JP2004035842A | ||||
| JP2014139297A |
Foreign References:
| WO2010131616A1 |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Hiroyuki Hirano
Yoshinori Shimizu
Hiroyuki Hirano