To solve problems that the follow-up to bumps cannot be made and dimples (recessed parts of the back surface ground parts) corresponding to the bumps or cracks are formed to cause deterioration of thickness accuracy of a pressure-sensitive adhesive sheet or blocking during molding of a substrate of the pressure-sensitive adhesive sheet even if the follow-up can be made when an electronic member such as a semiconductor wafer having the bumps such as a circuit surface having unevennesses of ≥25 μm or solder balls is ground, etc.

The pressure-sensitive adhesive sheet is obtained by laminating a reinforcing layer, a flexible layer, an intermediate layer and a pressure-sensitive adhesive layer in the order mentioned. The reinforcing layer has 40-90 Shore D hardness and 5-1,000 μm thickness and the flexible layer has 20-80 Shore A hardness and 50-1,000 μm thickness. The intermediate layer has 40-90 Shore D hardness and 5-100 μm thickness.

COPYRIGHT: (C)2007,JPO&INPIT