Title:
ADHESIVE, ADHESIVE SHEET, AND FLEXIBLE COPPER-CLAD LAMINATE
Document Type and Number:
Japanese Patent JP2023000498
Kind Code:
A
Abstract:
To develop an adhesive for a flexible copper-clad laminate that provides FCCL with excellent dimensional stability without copper foil breakage or wrinkles while achieving both properties comparable to those of the casting method 2-layer FCCL and productivity higher than that of the lamination method 2-layer FCCL, an adhesive sheet manufactured by the same, and a lamination method flexible copper-clad laminate.SOLUTION: An adhesive for a flexible copper-clad laminate for bonding a polyimide film substrate and a copper foil that make up a flexible copper-clad laminate includes a solvent soluble polyimide, a phenoxy resin having a glass transition temperature (Tg) of 120°C or less, an epoxy resin, and an epoxy resin hardener, and there are also provided an adhesive sheet using the same, a flexible copper-clad laminate, and a manufacturing method of the same.SELECTED DRAWING: None
Inventors:
SUZUKI TETSUAKI
KUROSAWA INETARO
KUROSAWA INETARO
Application Number:
JP2021101358A
Publication Date:
January 04, 2023
Filing Date:
June 18, 2021
Export Citation:
Assignee:
HEFEI HANNOWA NEW MATERIALS TECH CO LTD
International Classes:
H05K1/03; C09J7/35; C09J163/00; C09J171/08; C09J179/08
Attorney, Agent or Firm:
Patent Attorney Corporation Tanikawa International Patent Office
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