Title:
粘着シート、その製造方法および積層セラミックシートの切断方法
Document Type and Number:
Japanese Patent JP4849993
Kind Code:
B2
Abstract:
The present invention relates to an adhesive sheet including a substrate and, an adherent layer containing heat-expandable microspheres, the adherent layer being disposed on at least one side of the substrate, in which the adherent layer has a thickness of 10 to 38 µm, and wherein the heat-expandable microspheres have a maximum particle diameter equal to or smaller than the thickness of the adherent layer and have a mode diameter of 5 to 30 µm. The adhesive sheet of the invention enables a high-accuracy processing in the step of processing an electronic part such as a small ceramic capacitor to thereby greatly improve product characteristics and productivity.
Inventors:
Takamasa Hirayama
Kazuyuki Kiuchi
Masaaki Sato
Yukio Arimitsu
Daisuke Shimokawa
Tomoko Kishimoto
Kazuyuki Kiuchi
Masaaki Sato
Yukio Arimitsu
Daisuke Shimokawa
Tomoko Kishimoto
Application Number:
JP2006220839A
Publication Date:
January 11, 2012
Filing Date:
August 14, 2006
Export Citation:
Assignee:
NITTO DENKO CORPORATION
International Classes:
C09J7/29; C09J11/06; C09J11/08; C09J133/00
Domestic Patent References:
| JP2005314708A | ||||
| JP2004277749A | ||||
| JP2005255829A | ||||
| JP2005075884A | ||||
| JP2005019518A | ||||
| JP2005023286A | ||||
| JP2003309088A | ||||
| JP2005255866A | ||||
| JP2004181308A | ||||
| JP2005070139A | ||||
| JP2005200505A |
Attorney, Agent or Firm:
Yukihisa Goto