Title:
ADHESIVE SHEET FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE USING THE SAME
Document Type and Number:
Japanese Patent JP2002033354
Kind Code:
A
Abstract:
To provide a new TAB tape which is superior in adhesion, wire- bonding characteristics, and punching-out characteristics, together with a semiconductor device using it.
An adhesive sheet for a semiconductor device is provided which comprises a laminate, comprising at least one layer of a protective film layer and an adhesive layer. Here, the adhesive layer comprises polyamide (A), an epoxy resin (B), and a phenol resin (C), with the epoxy resin (B) comprising at least a compound, represented by a general expression (1) (where, at least two of R1-R6 are glycidyl ether groups, with the rest being selected from among hydrogen atom, lower alkyl group of carbon number 1-4, or halogen atom, which can be identical.
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Inventors:
TSUTSUMI YASUAKI
KAMEI RYUICHI
SHIMIZU TAKESHI
KAMEI RYUICHI
SHIMIZU TAKESHI
Application Number:
JP2000213863A
Publication Date:
January 31, 2002
Filing Date:
July 14, 2000
Export Citation:
Assignee:
TORAY INDUSTRIES
International Classes:
C09J7/02; C09J161/06; C09J163/00; C09J177/00; H01L21/60; (IPC1-7): H01L21/60; C09J7/02; C09J161/06; C09J163/00; C09J177/00
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