Title:
半導体ウエハ加工用粘着シート
Document Type and Number:
Japanese Patent JP4608759
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a pressure-sensitive adhesive sheet for semiconductor wafer processing which reduces imperfections and, at the same time, excels in resistance to chipping and prevents the scattering of chips on dicing in the semiconductor wafer processing. SOLUTION: The pressure-sensitive adhesive sheet for semiconductor wafer processing is obtained by coating a pressure-sensitive adhesive layer comprising a base resin, a radiation polymerizable compound, a radiation polymerization initiator, and a crosslinking agent on the surface of an ultraviolet- and/or electron radiation-transmitting film base and has a tack to the silicon wafer mirror surface of 200-2,000 gf/25 mm before radiation irradiation and a tack of 10-50 gf/25 mm after radiation irradiation and, simultaneously, a cohesive strength, prescribed by the holding power of JIS Z0237, of <=5 mm.
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Inventors:
Naoya Oda
Takenori Yukinori
Takenori Yukinori
Application Number:
JP2000319184A
Publication Date:
January 12, 2011
Filing Date:
October 19, 2000
Export Citation:
Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
C09J7/02; C09J4/02; C09J4/06; C09J131/04; C09J133/04; C09J133/14; C09J175/16; H01L21/301
Domestic Patent References:
| JP11061065A | ||||
| JP10310748A | ||||
| JP11293201A | ||||
| JP6061346A | ||||
| JP2000281993A |