Title:
ワーク加工用粘着シートおよびその製造方法
Document Type and Number:
Japanese Patent JP6831725
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an adhesive sheet for workpiece processing in which adhesive residue in a work piece having a recess on a surface is suppressed while having an adhesive layer constituted by an energy ray-curable adhesive and a conductive layer, and a method of manufacturing the adhesive sheet for workpiece processing.SOLUTION: There is provided an adhesive sheet 1 for workpiece processing having a substrate 11, a conductive layer 12 laminated on a single sided surface side of the substrate 11, and an adhesive layer 13 laminated on an opposite side surface to the substrate 11 in the conductive layer 12, the adhesive layer 13 is constituted by an energy ray curable adhesive, a surface of an adhesive layer 13 side in the adhesive sheet 1 for workpiece processing is fixed in a supporter, and interlaminar strength measured as a peel force when a laminate consisting of the substrate 11 and the conductive layer 12 is peeled at 180° from the adhesive layer 13 at a peel rate of 300 mm/min. after irradiating an energy ray to the adhesive layer 13 is 17 N/25 mm or more.SELECTED DRAWING: Figure 1
Inventors:
Takafumi Ogasawara
Naoki Saeki
Naoki Saeki
Application Number:
JP2017052610A
Publication Date:
February 17, 2021
Filing Date:
March 17, 2017
Export Citation:
Assignee:
LINTEC CORPORATION
International Classes:
C09J7/38; B32B27/00; B32B27/16; B32B38/18; C09J7/29; C09J201/00; H01L21/301; H01L21/304
Domestic Patent References:
| JP2011210989A | ||||
| JP2011248629A | ||||
| JP2006095875A | ||||
| JP2007161857A | ||||
| JP2012176555A | ||||
| JP8272297A |
Foreign References:
| WO2016031788A1 |
Attorney, Agent or Firm:
Yuji Hayakawa
Keisuke Murasame
Iida Riki
Keisuke Murasame
Iida Riki