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Title:
ADHESIVE STATE INSPECTING APPARATUS AND METHOD
Document Type and Number:
Japanese Patent JP2005321358
Kind Code:
A
Abstract:

To provide an adhesive state inspecting apparatus and a method for inspecting an adhesive state, even if the adhesive state between two solids into which ultrasonic waves cannot enter, and when a product is large and abnormal section is small.

When the adhesive state between a magnet 1 and a base material 2 is inspected, a coil 3 is provided in the vicinity of the magnet 1; a magnetic field is generated by applying an AC signal from a transceiver 5 to the coil 3; the magnet 1 is vibrated by electromagnetic induction action between a current created by the magnetic field and a magnetic field generated by the magnet 1; fluctuations due to the vibration of the magnet 1 are detected by a laser displacement gauge 4; and the adhesive state, between the magnet 1 and the base material 2, is inspected based on a detection signal.


Inventors:
KIMURA TOMONORI
MISU KOICHIRO
WADAKA SHUZO
TSUTSUMI SEISUKE
KOIKE MITSUHIRO
Application Number:
JP2004141340A
Publication Date:
November 17, 2005
Filing Date:
May 11, 2004
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
G01N29/12; G01H9/00; G01H11/08; G01N29/04; (IPC1-7): G01N29/12; G01H9/00; G01H11/08; G01N29/04
Attorney, Agent or Firm:
Michiteru Soga
Michiharu Soga
Hidetoshi Furukawa
Suzuki Kenchi
Kajinami order