Title:
ADHESIVE STRUCTURE
Document Type and Number:
Japanese Patent JP2023115708
Kind Code:
A
Abstract:
To provide an adhesive structure that is less prone to degradation or deterioration due to heat, and also has high adhesive strength.SOLUTION: An adhesive structure includes a substrate and triangular wave-shaped protrusions on the surface of at least a portion of the substrate. The triangular wave-shaped protrusions are composed of inorganic material. The average pitch of the triangular wave-shaped protrusions is in the range of 100 nm to 1000 nm, and the average height of the triangular wave-shaped protrusions is in the range of 100 nm to 1000 nm.SELECTED DRAWING: Figure 1
Inventors:
MAENO YOHEI
Application Number:
JP2022018074A
Publication Date:
August 21, 2023
Filing Date:
February 08, 2022
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP
International Classes:
C09J5/00; F16B11/00
Attorney, Agent or Firm:
Yasushi Matsunuma
Mitsuo Teramoto
Fumihiro Hosokawa
Onami Kazunori
Mitsuo Teramoto
Fumihiro Hosokawa
Onami Kazunori
Previous Patent: Inspection system, information processing device, inspection method, and program
Next Patent: adhesive structure
Next Patent: adhesive structure