To provide an adhesive substrate having a heat radiation plate, having a thermoplastic polyimide excellent in heat resistance after absorbing moisture and fixing the tip end of a lead frame.
This adhesive substrate having the heat radiation plate for fixing the lead frame obtained by laminating a non-thermoplastic polyimide layer and a thermoplastic polyimide layer in this order on the one side surface of a metal plate becoming the heat radiation plate is characterized by using 1,3-bis(3-aminophenoxy)benzene (hereinafter abbreviated sometimes as APB) as a diamine component and 3,3',4,4'-benzophenonetetracarboxylic acid dianhydride (hereinafter abbreviated sometimes as BTDA) as a tetracarboxylic acid dianhydride component of the resin for forming the thermoplastic polyimide layer by 0.900-0.998 molar using ratio of (tetracarboxylic acid dianhydride/APB).
MORI MINEHIRO
KODAMA YOICHI
