Title:
TAB用接着剤付きテープおよび半導体接続基板並びに半導体装置
Document Type and Number:
Japanese Patent JP3596237
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To improve the adhesive property, the chemical resistance and the insulating characteristics at a high temperature by a method wherein a thermoplastic resin, an epoxy resin, silica particles and a silane coupling agent are contained as essential components in an adhesive layer of the tape with adhesive for TAB. SOLUTION: A thermoplastic resin, an epoxy resin, silica particles and silane coupling are contained as essential components in an adhesive layer 2 of the tape with adhesive for TAB composed of a laminated body having a plastic organic insulating film 1, an adhesive layer 2 and a protective film layer. The silica particles are in the mean particle diameter not exceeding about 10μm and the maximum particle diameter not exceeding about 20μm while the blending ratio thereof about 5-70wt.% of the whole adhesive layer. Furthermore, the surface of the silica particles is to be previously processed with the silane coupling agent whose additive amount is to be about 0.5-10wt.% to the 100wt.% of the silica particles. Through these procedures, the adhesive property, the chemical resistance and the insulating characteristics at a high temperature can be improved.
Inventors:
Yasushi Sawamura
Yoshio Ando
Shoji Kikoshi
Yoshio Ando
Shoji Kikoshi
Application Number:
JP12214297A
Publication Date:
December 02, 2004
Filing Date:
May 13, 1997
Export Citation:
Assignee:
TORAY INDUSTRIES,INC.
International Classes:
C09J7/02; C09J161/04; C09J163/00; C09J177/00; H01L21/60; (IPC1-7): H01L21/60; C09J7/02; C09J161/04; C09J163/00; C09J177/00
Domestic Patent References:
| JP5029398A | ||||
| JP5206215A | ||||
| JP7062324A |