Title:
TAB用接着剤付きテープおよび半導体接続基板並びに半導体装置
Document Type and Number:
Japanese Patent JP3612921
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain a product superior in adhesion, chemicals resistance and insulation by using an adhesive layer contg. a thermoplastic resin A and an epoxy resin B which contains an epoxy resin shown by specified formula as a necessary component. SOLUTION: A tape with adhesive for TAB is composed of a laminate of an adhesive layer and protective film layer on a flexible org. insulation film. The adhesive layer contains a thermoplastic resin A and an epoxy resin B which contains an epoxy resinshown by the formula as a necessary component, wherein two of R1-R8 are H atoms and C1-C4 are lower alkyl groups or halogen atoms. The thermoplastic resin A uses e.g. a polyamide resin contg. 36C dicarboxylic acid. and the epoxy resin B uses a dicyclopentadiene type epoxy resin.
Inventors:
Yasushi Sawamura
Yukitsuna Konishi
Shoji Kikoshi
Yukitsuna Konishi
Shoji Kikoshi
Application Number:
JP3594197A
Publication Date:
January 26, 2005
Filing Date:
February 20, 1997
Export Citation:
Assignee:
TORAY INDUSTRIES,INC.
International Classes:
B32B7/12; C09J7/02; C09J163/00; C09J177/00; C09J177/06; H01L21/60; (IPC1-7): H01L21/60; B32B7/12; C09J7/02; C09J163/00; C09J177/06
Domestic Patent References:
| JP5291356A | ||||
| JP2051519A | ||||
| JP7118503A | ||||
| JP7118504A | ||||
| JP8008306A | ||||
| JP6236906A |