Title:
TAB用接着剤付きテープおよび半導体装置
Document Type and Number:
Japanese Patent JP3572815
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain a tape with adhesive for TAB having improved insulation and heat-resistance deformation property by allowing an adhesive layer to include modified polyamide resin with a specific substituent group as an essential ingredient. SOLUTION: A tape with adhesive for TAB is constituted of a lamination body having an adhesive layer and a protection film layer on a flexible organic insulation film. Then, the adhesive layer contains a modified polyamide resin with a substituent group expressed by a shown general expression as an essential ingredient (x-z: natural numbers, x=1-3, y=0-3, z=0-3, 1<=(x+y+z)<=5). Also, R is monovalence hydrocarbon group with C11-C12. For example, a specific amount of non-modified polyamide resin, resolphenol resin, and paratoluenesulfone acid are dissolved into benzine alcohol, are reacted at 130 deg.C for two hours, are precipitated again and refined by acetone, and are dried in vacuum to obtain a modified polyamide resin.
Inventors:
Shoji Kikoshi
Yasuya Sugiura
Taku Hatano
Yasuya Sugiura
Taku Hatano
Application Number:
JP21269796A
Publication Date:
October 06, 2004
Filing Date:
August 12, 1996
Export Citation:
Assignee:
TORAY INDUSTRIES,INC.
International Classes:
C09J7/02; C09J161/06; C09J163/00; C09J177/00; H01L21/60; (IPC1-7): H01L21/60; C09J7/02; C09J177/00
Domestic Patent References:
| JP7196989A | ||||
| JP6346042A |