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Patent Searching and Data


Title:
弾性一部品構造用接着テープ
Document Type and Number:
Japanese Patent JP7282204
Kind Code:
B2
Abstract:
The present disclosure relates generally to the field of adhesives, more specifically to the field of structural adhesive tapes, in particular for use in bonding metal parts. The present disclosure also relates to a method of bonding two parts and to a composite article. The present disclosure is further directed to the use of a structural adhesive tape for industrial applications, such as construction and automotive applications, in particular for body-in-white bonding applications in the automotive industry.

Inventors:
Jun, Adrian Tea.
Tash, Boris
Application Number:
JP2021558972A
Publication Date:
May 26, 2023
Filing Date:
March 30, 2020
Export Citation:
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Assignee:
3M Innovative Properties Company
International Classes:
C09J171/00; C09J7/21; C09J163/00
Domestic Patent References:
JP2013538271A
JP11501075A
JP2014504663A
JP2004530756A
Foreign References:
WO2018134721A1
WO2019003138A1
Attorney, Agent or Firm:
Ken Fujii
Taro Akazawa
Wakako Nomura
Tsukuda Seigen
Hideto Asamura