Title:
接着テープ及び接着テープの使用方法
Document Type and Number:
Japanese Patent JP4977618
Kind Code:
B2
Abstract:
Heat-activable adhesive tape for producing and reprocessing flexible circuit boards has an adhesive composition containing, at least, (a) an acid- or acid anhydride-modified acrylonitrile-butadiene copolymer and (b) an epoxide resin such that the a/b weight ratio is over 1.5 and no additional polymer hardener is used.
Inventors:
Krabinkel, Torsten
Ring, christian
Ring, christian
Application Number:
JP2007541931A
Publication Date:
July 18, 2012
Filing Date:
November 11, 2005
Export Citation:
Assignee:
Theza Societas Europe
International Classes:
H05K1/14; C09J7/10; C09J11/00; C09J109/02; C09J113/00; C09J163/00; H05K3/36; H05K3/38
Domestic Patent References:
| JP2000004074A | ||||
| JP5287255A | ||||
| JP2001011415A | ||||
| JP7316525A | ||||
| JP3068673A | ||||
| JP64087667A | ||||
| JP3028285A | ||||
| JP6330016A | ||||
| JP61076579A |
Attorney, Agent or Firm:
Patent business corporation Odashima patent office