Title:
ADHESIVE TAPE FOR TAB AND SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP3700243
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an adhesive tape for TAB(tape automated bonding) having high adhesion after a resist process and a plating process and excellent moisture resistance and insulation and improve the reliability of a semiconductor device using the tape.
SOLUTION: An adhesive tape for TAB is composed of a laminated body having an adhesive layer and a protection film layer on a flexible organic insulating film. The adhesive layer contains thermoplastic resin (A), epoxy resin (B) and silica powder (C) as essential components, and the average grain diameter of the silica powder (C) is 10μm or less, the maximum particle diameter, 20μm or less, and the silica powder (C) is contained by 5-70wt.% to the whole composition.
Inventors:
Yasushi Sawamura
Taku Hatano
Shoji Kikoshi
Taku Hatano
Shoji Kikoshi
Application Number:
JP11362296A
Publication Date:
September 28, 2005
Filing Date:
May 08, 1996
Export Citation:
Assignee:
TORAY INDUSTRIES,INC.
International Classes:
C09J7/02; C08G59/20; C08G59/24; C09J161/04; C09J161/06; C09J163/00; C09J177/00; H01L21/60; (IPC1-7): H01L21/60; C08G59/24; C09J7/02; C09J161/04; C09J163/00; C09J177/00
Domestic Patent References:
| JP5029398A | ||||
| JP6212134A | ||||
| JP7228671A | ||||
| JP6228308A | ||||
| JP7090238A |