Title:
接着テープ
Document Type and Number:
Japanese Patent JP2007532747
Kind Code:
A
Abstract:
The present invention provides an adhesive tape prepared by coating the one side or both sides of a substrate film with an adhesive composition including an acrylonitrile-butadiene copolymer or an acrylonitrile-butadiene-acrylic acid terpolymer containing carboxyl groups, an epoxy resin, a modified epoxy resin, a curing agent, an antioxidant, a filler, and other additives, the adhesive tape being excellent in thermal shrinkage and outgas rate to guarantee a high reliability in the semiconductor chip manufacturing process.
Inventors:
Kim Sun-Kyun
Moon John-Yor
Chun Chan-Bomb
Park Jung-Min
Moon John-Yor
Chun Chan-Bomb
Park Jung-Min
Application Number:
JP2007508278A
Publication Date:
November 15, 2007
Filing Date:
April 14, 2005
Export Citation:
Assignee:
Kolon Industries Inc.
International Classes:
B05D5/10; C09J7/22; C09J7/35; C09J11/04; C09J11/06; C09J109/02; C09J113/00; C09J151/04; C09J155/00; C09J155/02; C09J163/00; C08L61/00; C08L63/00
Attorney, Agent or Firm:
Masayuki Masabayashi
Ryoichi Takaoka
Hayashi Ichiyoshi
Kiyoshi Kato
Ryoichi Takaoka
Hayashi Ichiyoshi
Kiyoshi Kato