Title:
ADHESIVE FOR THERMAL FUSION BONDING, AND ADHESIVE CLOTH
Document Type and Number:
Japanese Patent JP2005126563
Kind Code:
A
Abstract:
To provide an adhesive for thermal fusion bonding which, even when subjected to high-temperature thermal fusion bonding for a long time, gives an adhesive interlining with sufficient adhesive power.
The adhesive for thermal fusion bonding comprises an aqueous thermoplastic resin dispersion prepared by heating a thermoplastic resin to its softening point or higher and dispersing the softened thermoplastic resin in an aqueous medium and contains inorganic particles having a wt. average particle size of 0.001-20 μm. The adhesive is thermally fusion bonded to the surface of a base fabric, giving an adhesive cloth.
Inventors:
SUGIHARA NORIHIRO
NAKAO KEIICHIRO
NAKAO KEIICHIRO
Application Number:
JP2003363256A
Publication Date:
May 19, 2005
Filing Date:
October 23, 2003
Export Citation:
Assignee:
SUMITOMO SEIKA CHEMICALS
International Classes:
B32B27/00; B32B27/12; C09J11/04; C09J167/00; C09J177/00; C09J177/02; C09J177/06; C09J201/00; (IPC1-7): C09J201/00; B32B27/00; B32B27/12; C09J11/04; C09J167/00; C09J177/00; C09J177/02; C09J177/06
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