Title:
ADHESIVE
Document Type and Number:
Japanese Patent JPS51132232
Kind Code:
A
Abstract:
a hot melt adhesive comprising a silicone block copolymer and a tackifier. The composition may also comprise a polyester. The adhesive makes it possible to form an unexpectedly strong bond with substrates having low surface energy without having to etch the surface of the substrate.
Inventors:
EDOWAADO FURANKU JIYONSON
JIYON SUCHIIBUN KAARUSEN
JIYON SUCHIIBUN KAARUSEN
Application Number:
JP3115176A
Publication Date:
November 17, 1976
Filing Date:
March 22, 1976
Export Citation:
Assignee:
RAYCHEM CORP
International Classes:
C08G77/00; C08G77/42; C09J183/00; C09J183/10; (IPC1-7): C08L83/10; C09J3/16