Title:
ADJUSTING MECHANISM OF WAFER TRANSFER DEVICE
Document Type and Number:
Japanese Patent JP3874876
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To adjust deflection and an inclination of a tweezer, and prevent damage of a wafer and a board by supporting a transfer machine upward by an angle corresponding to a previously found tweezer length by plural blocks supported in parallel to the lengthwise direction of the tweezer, and making a fine adjustment in the vertical and lateral directions on the blocks.
SOLUTION: A tweezer 1 is loaded on an installing block 23. At this time, the tweezer 1 is moved up to a position noninterfering with a block A14 and a block B15 by using a vertically adjusting knob 17 and a laterally adjusting knob 18. Next, the tweezer 1 is inclined upward by a previously found angle quantity so as to maintain a prescribed adjusting quantity on the basis of a calculation of a deflection quantity by using an adjusting screw added to an installing block 23 to the tweezer 1. Respective tweezers 1 are adjusted so that an under surface of the tweezers 1 and the respective blocks contact with each other. Afterwards, the fact that the tweezers 1 do not push the blocks is confirmed by lowering the block A14 and the block B15 by using the vertically adjusting knob 17.
Inventors:
Satoshi Kakizaki
Makoto Tsuri
Mitsuru Sakamoto
Makoto Tsuri
Mitsuru Sakamoto
Application Number:
JP4918697A
Publication Date:
January 31, 2007
Filing Date:
March 04, 1997
Export Citation:
Assignee:
Hitachi Kokusai Electric Co., Ltd.
International Classes:
B65G49/07; H01L21/677; H01L21/68; (IPC1-7): B65G49/07; H01L21/68
Domestic Patent References:
| JP63106127U | ||||
| JP61020046U | ||||
| JP2072542U |
Attorney, Agent or Firm:
Yoshihiko Izumi
Shigeru Kobayashi
Shigeru Kobayashi