Title:
ADJUSTMENT FOR THICKNESS OF LEAD FRAME PLATE
Document Type and Number:
Japanese Patent JPS57155756
Kind Code:
A
Abstract:
PURPOSE: To prevent the occurrence of resin burr by resin mold by a method wherein plating for adjusting plate thickness is applied to the blank of a lead frame and then resin mold is performed.
CONSTITUTION: A plating layer 24 for adjusting the plate thickness with a thickness of about 1W50μm is applied to the whole surface of the blank 22 of a lead frame. Furthermore, a finishing plating layer 26 is applied on the layer 24 to equalize the whole thickness and then resin mold is performed. In this way, the adhesion of the lead frame and mold becomes good and the occurrence of resin burr is prevented.
Inventors:
TSUSHIMA KUNIO
MAEDA MASANORI
MAEDA MASANORI
Application Number:
JP4030581A
Publication Date:
September 25, 1982
Filing Date:
March 23, 1981
Export Citation:
Assignee:
HITACHI LTD
International Classes:
H01L23/50; H01L23/495; (IPC1-7): H01L23/48