Title:
瞬鋭なる終点検出を用いた高等な化学機械的研磨システム
Document Type and Number:
Japanese Patent JP2005525244
Kind Code:
A
Abstract:
An apparatus for polishing a workpiece includes a workpiece holder 104 configured to hold the workpiece, a polishing member 102 configured to be positioned adjacent to a face of the workpiece in order to polish the workpiece face with a front side of the polishing member, and a platen 600 having a plurality of pressure zones zl-z4 configured to selectively apply pressure to the polishing member thereby causing the polishing member to contact the workpiece face with selective pressure. In another embodiment, the apparatus includes a pressure controller 564 coupled to the platen and configured to selectively adjust the pressure zones zl-z4.
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Inventors:
One, Yuchun
Frey, Bernard M
Bazor, Brent M
Tarlier, Homayoung
Young, Douglas
McGrath, Brett Yee
Desai, Mukesh
Velazquez, Efline
Truong, Tuan
Frey, Bernard M
Bazor, Brent M
Tarlier, Homayoung
Young, Douglas
McGrath, Brett Yee
Desai, Mukesh
Velazquez, Efline
Truong, Tuan
Application Number:
JP2003572724A
Publication Date:
August 25, 2005
Filing Date:
January 17, 2003
Export Citation:
Assignee:
Yes M Natur Inc.
International Classes:
B24B49/12; B24B1/00; B24B17/10; B24B21/04; B24B37/20; B24B49/16; H01L21/304; (IPC1-7): B24B37/00; B24B1/00; B24B17/10; B24B37/04; B24B49/12; H01L21/304
Attorney, Agent or Firm:
Takehiko Suzue
Satoshi Kono
Makoto Nakamura
Kurata Masatoshi
Takashi Mine
Yoshihiro Fukuhara
Sadao Muramatsu
Ryo Hashimoto
Satoshi Kono
Makoto Nakamura
Kurata Masatoshi
Takashi Mine
Yoshihiro Fukuhara
Sadao Muramatsu
Ryo Hashimoto