Title:
多相系のための高度な流体接続設計
Document Type and Number:
Japanese Patent JP7317163
Kind Code:
B2
Abstract:
A cooling arrangement for an electronic rack of a data center having a rack manifold with liquid supply line to receive first cooling liquid from a cooling liquid source and liquid return line to return first warmer liquid back to the cooling liquid source. A plurality of server chassis are arranged in a stack, each server chassis including one or more fluid cooling devices associated with one or more information technology (IT) components. A plurality of connector modules are attached to the servers, each providing fluid connections between the fluid cooling devices and the cooling liquid source on the racks; wherein each of the connector module comprises a frame having mounts configured for attaching the frame onto the server a plurality of channels formed in the frame to accept the fluid connectors; and, a plurality of fluid connectors slidably mounted in the channels.
Inventors:
Gao, Tian Yui
Application Number:
JP2022020996A
Publication Date:
July 28, 2023
Filing Date:
February 15, 2022
Export Citation:
Assignee:
Baidu USA LLC
International Classes:
G06F1/20
Domestic Patent References:
| JP2009532871A | ||||
| JP2019012470A |
Foreign References:
| US20160270260 |
Attorney, Agent or Firm:
Michihiro Izumi
Kyosuke Kutsune
Kensuke Terakawa
Kyosuke Kutsune
Kensuke Terakawa
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