AGING DEVICE

Japanese Patent JPS63204621

A

PURPOSE: To increase the yield of multichip LSI by a method wherein the aging in wafer state is performed by means of bringing contactors into contact with power supply pads to be supplied with voltage.

CONSTITUTION: Multiple sheets containing 4 each of wafers 40 inserted into containing grooves one by one are successively contained in containing shelves. Besides, probes 21 are brought into contact with power supply pads 41 of respective chips on the wafer 40 while the inside of probe guard main body 22 is heated to keep the temperature of e.g. at 125°C using a thermostat maintaining the wafers for specified time. Later, the wafers are picked up to be probe-tested for eliminating any defective ones and assembling acceptable ones only into a package. Through these procedures, the yield of multichip LSI can be increased cutting down the cost to achieve the anticipated effect.

INADA SHINICHIRO
NISHIWAKI NOBUHIRO
SAITO TAKESHI

JP3554587A

August 24, 1988

February 20, 1987

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HITACHI LTD
HITACHI COMPUTER ENG

H01L21/66; G01R31/26; H01L21/326; (IPC1-7): G01R31/26; H01L21/326; H01L21/66

Katsuo Ogawa

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