Title:
チップ部品の整列方法
Document Type and Number:
Japanese Patent JP7122135
Kind Code:
B2
Abstract:
To provide an alignment method of a chip component, capable of effectively aligning the chip component.SOLUTION: A alignment method is for aligning a plurality of chip components 11 by using a tool 100 of a nonmagnetic material having a plurality of concave parts. Each chip component comprises: a pair of main surfaces opposite in a lamination direction of an inner electrode; a pair of end surfaces opposite in a longitudinal direction orthogonal to the lamination direction; and a pair of side surfaces which are opposite to a width direction orthogonal to the lamination direction and the longitudinal direction, and in which the inner electrode exposes. Each chip component is arranged in each concave part formed in a first direction. On the tool in which the plurality of chip components are arranged, a cover member 200 covering an opening of each concave part is arranged, so an alignment case 300 having a plurality of closed spaces S housing each chip component is manufactured. By moving a magnet along a surface directed in the first direction of the aligning case, the plurality of chip components are aligned so that the pair of side surfaces direct in the first direction.SELECTED DRAWING: Figure 12
Inventors:
Hidenori Wakayanagi
Shota Tanaka
Shin Nakayasu
Akira Furusawa
Shota Tanaka
Shin Nakayasu
Akira Furusawa
Application Number:
JP2018059536A
Publication Date:
August 19, 2022
Filing Date:
March 27, 2018
Export Citation:
Assignee:
TAIYO YUDEN CO.,LTD.
International Classes:
H01G13/00
Domestic Patent References:
| JP2003007574A | ||||
| JP2017054980A | ||||
| JP2017057080A | ||||
| JP2008091658A | ||||
| JP2018098413A | ||||
| JP10284355A | ||||
| JP2012124525A | ||||
| JP2017010955A | ||||
| JP2003142352A | ||||
| JP63018832U | ||||
| JP9022810A | ||||
| JP2014103195A | ||||
| JP9022845A |
Attorney, Agent or Firm:
Shuhei Katayama