To provide a material suitable for means for solving problems such as unevenness of land widths of holes and positional deviation between lands and holes, caused by alignment performed when forming an etching resist layer and a plating resist layer.
The alkali-soluble resin composition is used as a first resin layer in a method for producing a printed circuit board and the resin composition has ≥1011 Ωcm volume resistivity. The method for producing the printed circuit board comprises a step for forming the first resin layer composed of the alkali-soluble resin composition on the surface of an insulating basal plate having a through hole or/and a non-through hole and having a conductive layer on at least the surface, a step for forming a second resin layer which is insoluble or sparingly soluble in a developing solution for first resin layer on the first resin layer on the surface conductive layer and subsequently, a step for removing the first resin layer on the holes by the developing solution for first resin layer.
IRISAWA MUNETOSHI
KANEDA YASUO
